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iCs and micro systems featuring optical sensors require special packages to allow the incidence of light. Also the reduction of required space calls for chip-scale packages or customized chip-on-board (COB) micro systems. Thus combining the glass-on-chip technique with new PCB technologies available (HDI) iC-Haus introduced the optoBGA™ package as the final step towards real chip-scale size especially for integrated circuits featuring optical sensors. Benefit from our know-how and facilities to let iC-Haus present you packaging solutions for sensors, multichip modules and micro systems. For more details feel free to contact us:
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