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iC-Haus develops and manufactures application-specific standard products (ASSPs), application-specific integrated circuits (ASiCs) and is a leading specialist for monolithic mixed-signal circuits and microsystems. Our wafer backend, chip-assembly- and test-facilities are located in Bodenheim near Frankfurt in the center of Europe. Our subcontracted wafer foundries and assemblers are situated all over the world and assure reliable, secondsourced products and deliveries. Quality engineering has been established in international standards, such as ISO9001. iC-Haus products are authorized for automotive, military and industrial use and follow FMEA methods and safety requirements.




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Cooperation iC-Haus with Chips4Light.

iC-Haus manufactures the first IO-Link chip, fully qualified and in series production.
Shanghai, March 16-18, 2010
Hannover, April 19-23, 2010
Nuremberg, May 18-20, 2010